Video Library

Video Library

Get a first-hand look at Indium Corporation's product, application, and technical expertise through our versatile video library.
*The video content below was created before the COVID-19 pandemic and does not reflect the current safety protocols upheld by Indium Corporation.

Applications: Packaging

Voiding in Die-Attach

Causes and Solutions for Voiding in Die-Attach

Flip-Chip/BGA Balling: Halogen-Free/Halide-Free

Flux Challenges Regarding Flip-Chip/BGA Balling

Adopting Semiconductor Assembly Process Techniques and Technologies

Driving the Packaging Frontier: Part 1

Applications: Sealing

Abundant Indium

Applications: Soldering

SMT Line Balancing Using LineCoach® Software

Tech Seconds with Phil Zarrow: How to Troubleshoot Head-in-Pillow (HIP) Defects

Avoid the Void®

Effect of Reflow Environment on No-Clean Residue and Surface Insulation Resistance (SIR)

SMT Processes Certification

Tech Seconds with Phil Zarrow: Kapton Tape for Reflow Profiling

Avoid the Void® Common Causes of Voiding in Electronics Assembly

Why Solder Paste is Not a Commodity: Properties that Make a Superior Solder Paste

Calculating Oddly Shaped Aperture Area Ratios

SMT Reflow Profiling: Using ReflowCoach®

Tech Seconds with Phil Zarrow: Paste Storage & Handling: Ambient Temperatures

Defects Eliminated. Reliability Delivered.

Printing Differences Between No-Clean and Water-Soluble Solder Pastes

How NanoFoil® is Used in Soldering Applications

SMT Wave Soldering: WaveCoach® Helps Optimize Profiling

Tech Seconds with Phil Zarrow: Paste Storage & Handling: Leftover Paste

Design Solutions for Engineered Solders

Avoid the Void®: Voiding in High-Temperature Soldering

How Process Variables Affect Variation in QFN Voiding

Solder Fortification for Electronics Assembly

Tech Seconds with Phil Zarrow: X-ray Analysis Electronics Assembly

Electrical, Thermal, and Mechanical Reliability of Electronics Assembly

Indium Corporation: Productivity

Solder Paste Storage & Handling Best Practices

Tech Seconds: Troubleshooting Voiding

Exploring the Wet Gold Technique to Measure Precious Metal Content

Indium Corporation: Profitability

Solder Redefined Video 1: Introduction

Tech Seconds: When to Use a Shoulder Profile

How to Properly Use Cp and Cpk in SMT Assembly

Indium Corporation: Response-To-Pause

Solder Redefined Video 2: Die-Attach

The Correct Formula for Solder Alloy Density

Importance of Profiling a Reflow Oven

Introduction to Head-in-Pillow and Non-Wet Open Defects

Solder Redefined Video 3: DBC Substrate to Baseplate

The Difference Between Halogen and Halides

Improve SMT Stencil Printing using StencilCoach®

Maximizing Uptime in Electronics Assembly

Surface-Mount: Reflow Soldering & Thermal Profiles

We Know SMT: Stencil Printing

In-Circuit Testing with Fast-Break Residue No-Clean Solder Paste

Minimizing Head-in-Pillow Defect in SMT Assembly

Tech Seconds with Phil Zarrow: Best Place to Attach Thermocouples

When to Use Nitrogen in SMT Wave Soldering

Solder Fortification

Overcoming the Challenges Associated with Halogen-Free

Tech Seconds with Phil Zarrow: Choosing a Solder Paste

Solder Redefined Video 4: Baseplate to Heat-Sink

Reducing Voiding in Bottom Terminated Components Using Solder Fortification® Preforms

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part I of III

Tech Seconds with Phil Zarrow: Choosing a Solder Paste Supplier

Tech Seconds: Voiding - Symptom or Defect?

Surface Insulation Resistance (SIR) and Flux Designation (ROL) Defined

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part II of III

Tech Seconds with Phil Zarrow: Considerations for Switching to a VOC-Free Wave Solder Flux

An Introduction to Particle Size and Printing Smaller Area Ratios

Process Capability: Cpk and Cpu in Relation to Purity of Compounds from Indium Corporation

Process Considerations for QFN Voiding in SMT Electronics Assembly: Part III of III

Tech Seconds with Phil Zarrow: How to Eliminate Head-in-Pillow (HIP) Defects

Assessing Field Reliability and Defect Rates in Electronics Assembly

Gold-Indium (AuIn) Alloys for High-Reliability Braze Solutions

RoHS Ten Years Later: The Transition to Lead-Free Electronics Assembly

Tech Seconds with Phil Zarrow: How to Select Wave Flux

Autonomous Automobiles: The Ultimate Electrical Reliability Challenge

Avoid the Void®: Beyond QFN Voiding

Applications: Thermal

LEDs Everywhere: How Indium Factors into LED Manufacturing