Products: Inorganic Compounds
Indium Corporation’s Innovations For the Factory Floor Part 1: EZ-Pour®
Liquid Metals Wet Glass @ Room Temperature: Indium Corporation
Indium Corporation’s Innovations For the Factory Floor Part 2: Indium Tri-Chloride Type H
EZ-Pour® Gallium Trichloride, Part 1
EZ-Pour® Gallium Trichloride, Part 2
Indium Acetate: Vivid Quantum Dots
Indium-Tin Oxide (ITO) Used in Flat-Panel Displays
Indium Tin Oxide: For Flat-Panel, Touch-Screen Technologies
Products: Metals
Indium Corporation: Melting Gallium with Body Heat
6 Alloy Families: Gallium
6 Alloy Families: Lead
Gallium Metal – Gallium is Great!
Indium Used for Pigment
The Hard Facts on Soft Metal
6 Alloy Families: Tin
6 Alloy Families: Gold
6 Alloy Families: Bismuth
6 Alloy Families: Indium I
6 Alloy Families: Indium II
Indium Metal – Reclaiming This Versatile Metal
Indium is Abundant!
Products: Solders
Rel-ion™ Driving e-Mobility: Uptime
Rel-ion™ Driving e-Mobility: Industry Development
Rel-ion™ Driving e-Mobility: Automotive Trends
Rel-ion™ Driving e-Mobility: EV Advancement
Rel-ion™ Technology: Proven Products for e-Mobility
Rel-ion™ Driving e-Mobility: Equal Opportunity Industry
12.8HF for Jetting and Microdispensing
Rel-ion™ Driving e-Mobility: Standards
Rel-ion™ Driving e-Mobility: Energy Storage
Rel-ion™ Driving e-Mobility: Collaboration
Rel-ion™ Driving e-Mobility: Indium Corporation’s Proven Products
InTACK™ Technology: The Solution for Power Module Assembly Tooling
InFORMS® for Power Module Reliability
Rel-ion™: The Future of EV is Here
Driving e-Mobility: Rel-ion™ Technical Webinars
AuLTRA™ ThInFORMS™ for Die-Attach Applications
Indium12.8HF Jetting and MicroDispense Paste’s Features
Achieve Better Dispensability with Indium12.8HF Jetting/Microdispensing
Indium12.8HF Solder Paste for Jetting and Microdispensing
Avoid the Void®: Indium8.9HF Solder Paste with Andreas Karch
Avoid the Void®: High-Temperature Soldering with Semiconductor-Grade Preforms
Indium Corporation’s Low-Spatter, Flux-Cored Robotic Soldering Wire
Indium Corporation - Soft Solder Superstars
Indium10.1 and Indium8.9HF Solder Pastes Help You Avoid the Void®
Indium8.9HF ‐ The Proven Automotive Solder Paste
Off-Eutectic Gold Tin Preforms
Rel-ion™: Proven Solders for Electric Vehicle Manufacturing
Durafuse® LT: The Ultimate Drop Shock Solution
Avoid the Void® Using Heat-Spring Metal Thermal Interface
Indium Corporation: Specifying solder preforms
Indium6.4R
Indium8.9 Pb-Free No-Clean Solder Paste
Indium8.9HF Solder Paste: Material Comparisons for Soldering Process Issues
Live @ APEX 2015
No-Clean vs. Water Soluble Solder Paste
Reducing Voiding with LV1000 Flux-Coated Solder Preforms
Selecting the Appropriate Halogen-Free Solder Paste
Solder Fortification® Using Preform-In-Paste (PiP) - Indium Corporation
Water Soluble vs. No Clean Technology
LV1000 Flux Coating for Solder Preforms
The Versatile Solder Preform
An Introduction to Particle Size and Printing Smaller Area Ratios
Indium Corporation: Flux-coated preforms - LV1000
Avoid the Void® with halogen-free Indium 8.9HF Solder Paste
Avoid the Void®: Voiding in Gold-Tin (AuSn20) Solder Joints
Benefits of Solder Fortification® Preforms
Calculating Confidence Intervals of Cpk in Stencil Printing
Choosing Flux-Coated Solder Preforms
Indium12.8HF Solder Paste Trusted by Jetting and Microdispensing Equipment Leaders
Flux-Cored Wire in Robotic Soldering
Voiding in Flux-Cored Wire
Indium Corporation: Heat-Spring® Thermal Interface Material INTRO
InFORMS® A Drop-In Replacement
Innovative Low-Temperature Alloy Innovation
Indium3.2HF Solder Paste
Products: Thin Film Materials
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