TaCking Agents
NC-702A para Flip-Chip
Indium Corporation’s tacking agents are designed for assembly processes that require a true no-clean approach. As chip input/output (I/O) counts increase and pitch reduction becomes more pronounced, removing residue after reflow can become difficult or even impossible. To mitigate this issue, fluxless reflow processes are often adopted to eliminate the risk of residue-related failures. Our tacking agents are compatible with formic acid reflow processes, providing an effective solution to these challenges.
Desarrollado por Indium Corporation
- True Near-Zero Residue Product
- High Tack Strength
- Acts as a Temporary Adhesive
Productos
Formic Acid Reflow
In a formic acid reflow process, there is no fluxing agent from applied materials such as traditional flux or solder paste. Instead, the forming gas acts as an oxide remover, enabling the formation of solder joints. This process can be carried out in either a conveyor reflow oven or a vacuum chamber.
Securely Positions Flip-Chips
Our NC-702A serves as a tacking agent, holding flip chips in place before the reflow process, similar to traditional flux. With its exceptional tack strength, NC-702A ensures the chip remains securely positioned during reflow.
Near-Zero Residue
NC-702A completely evaporates at the peak temperature of the standard mid-temperature alloy (SAC305). By applying a few dots of the material in the corners of a flip-chip die, you can achieve strong tackiness while ensuring complete material evaporation.
Fichas técnicas de productos
Solución adhesiva con residuo casi nulo PDS 99873 (A4) R3.pdf
Solución adhesiva con residuo casi nulo PDS 99873 R3.pdf
NC-702 Solución adhesiva con residuo casi nulo PDS 99873 R2.pdf
NC-702A Near-Zero Residue Adhesive Solution PDS 100161 R1.pdf
Aplicaciones relacionadas
NC-702A for flip-chip is available for use in a variety of applicaitons.
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Mercados relacionados
Indium Corporation’s NC-702A for flip-chip is suitable to be used in the following markets.
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