招标代理
NC-702A for Flip-Chip
Indium Corporation’s tacking agents are designed for assembly processes that require a true no-clean approach. As chip input/output (I/O) counts increase and pitch reduction becomes more pronounced, removing residue after reflow can become difficult or even impossible. To mitigate this issue, fluxless reflow processes are often adopted to eliminate the risk of residue-related failures. Our tacking agents are compatible with formic acid reflow processes, providing an effective solution to these challenges.
技术支持：铟泰公司
- True Near-Zero Residue Product
- High Tack Strength
- 用作临时粘合剂
产品概览
Formic Acid Reflow
In a formic acid reflow process, there is no fluxing agent from applied materials such as traditional flux or solder paste. Instead, the forming gas acts as an oxide remover, enabling the formation of solder joints. This process can be carried out in either a conveyor reflow oven or a vacuum chamber.
安全定位倒装芯片
Our NC-702A serves as a tacking agent, holding flip chips in place before the reflow process, similar to traditional flux. With its exceptional tack strength, NC-702A ensures the chip remains securely positioned during reflow.
Near-Zero Residue
NC-702A completely evaporates at the peak temperature of the standard mid-temperature alloy (SAC305). By applying a few dots of the material in the corners of a flip-chip die, you can achieve strong tackiness while ensuring complete material evaporation.
产品数据表
Near-Zero Residue Adhesive Solution PDS 99873 (A4) R3.pdf
Near-Zero Residue Adhesive Solution PDS 99873 R3.pdf
NC-702 Near-Zero Residue Adhesive Solution PDS 99873 R2.pdf
NC-702A Near-Zero Residue Adhesive Solution PDS 100161 R1.pdf
相关应用
NC-702A for flip-chip is available for use in a variety of applicaitons.
半导体封装和装配
关键的半导体封装确保了功能性和耐久性。
2.5D 和 3D 包装
Techniques to incorporate multiple dies in a…
倒装芯片
A crucial technique in advanced semiconductor packaging.
相关市场
Indium Corporation’s NC-702A for flip-chip is suitable to be used in the following markets.
专家支持，结果可靠
您有技术问题或销售咨询吗？我们的专业团队随时为您提供帮助。From One Engineer to Another®不仅是我们的一句口号，更是我们致力于提供卓越服务的承诺。只要您需要，我们随时待命。让我们联系吧！
寻找安全数据表？
您所需的一切——从技术规格到应用 ——都可在此一站式获取。
您的成功
是我们的目标
借助最新的材料、技术以及专家应用 优化您的生产流程。一切都始于与我们团队的联系。