Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
The world of semiconductor packaging has never been more diverse or more complex. Join leading experts to discuss solutions to current and emerging challenges in assembly processes, materials, and reliability, as well as packaging technology advances.
This event will cover advanced topics including wafer bumping, flip-chip, TSVs, 3D assembly, wire-bonded packages, and MEMS devices.
Early registration ends on Aug. 21. To register for the event, visit www.imaps.org/asp.
Upstate New York is now a major hub for semiconductor fabrication and assembly, and is a beautiful and exciting location at the forefront of major technology advances and electronics industry growth.
IMAPS is the world's largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
