Indium Corporation's Dr. Ron Lasky, Senior Technologist, and Eric Bastow, Assistant Technical Manager for the Americas, will present at the 2017 SMTA Puget Sound Symposium and Supplier Day on May 8 in Redmond, Wash.
Lasky's presentation, Minimizing Voiding in SMT Assembly of BTCs, reviews proven approaches to minimize voiding in bottom termination components, including solder paste optimization, process modifications, and the addition of solder preforms.
Bastow's presentation, Package-on-Package for 3D Packaging, discusses the pros and cons of the two common PoP designs and the various interconnect materials and processes that are used to stack them. It will also cover various parameters to optimize the PoP assembly process.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renowned process expert and a Senior Technologist at Indium Corporation. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion. Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at indiumstg.wpenginepowered.com/drlasky.
Bastow provides technical support for Indium Corporation's full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets to customers throughout the Americas. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH.
SMTA는 마이크로시스템, 신흥 기술 및 관련 비즈니스 운영을 포함한 전자 조립 기술 분야에서 기술을 구축하고, 실무 경험을 공유하며, 솔루션을 개발하는 전문가들의 국제적인 네트워크입니다.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
