Indium Corporation to Feature InFORMS Reinforced Solder Preforms for IGBT Assembly at NEPCON Japan

Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS^®, for IGBT assembly at NEPCON Japan, January 15-17, Tokyo, Japan.

Uneven solder bondline thickness between the substrate and baseplate of an IGBT module can create areas of increased stress, leading to delamination and premature failure during the operational life of the module. Indium Corporation’s InFORMS^® are a specially designed composite solder preform with a reinforcing matrix designed for all-around reliability. This results in:

• 기계적 및 열적 신뢰성 향상
• 일정한 접착선 두께
• 낮은 회피 성능

^InFORMS®는엔지니어들에게 더욱 신뢰할 수 있고 고성능의 모듈 개발을 위한 향상된 소재를 제공합니다. 평탄도가 개선되고 스탠드오프 공차가 확보됨에 따라 패키지 설계의 예측 가능성이 높아집니다. 또한, 더 견고하고 신뢰할 수 있는 접합부를 통해 높은 전력 밀도를 구현할 수 있습니다.

For more information about InFORMS^®, visit indiumstg.wpenginepowered.com/informs or visit us at booth #ISP2-0407.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer To^Another®(#FOETA)를 팔로우하실 수 있습니다.