Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, for IGBT assembly at NEPCON Japan, January 15-17, Tokyo, Japan.
Uneven solder bondline thickness between the substrate and baseplate of an IGBT module can create areas of increased stress, leading to delamination and premature failure during the operational life of the module. Indium Corporation’s InFORMS® are a specially designed composite solder preform with a reinforcing matrix designed for all-around reliability. This results in:
- Improved mechanical and thermal reliability
- Uniform bondline thickness
- Low-voiding performance
InFORMS®為工程師開發更可靠、更高性能的模組提供了增強的材料。由於平面度的改進和stand-off 公差，封裝設計變得更可預測。此外，更堅固、更可靠的接點可實現高功率密度。
For more information about InFORMS®, visit indiumstg.wpenginepowered.com/informs or visit us at booth #ISP2-0407.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
