Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at SMTA International (SMTAI) 2016 on Sept. 27 and 28, in Rosemont, Ill.
Indium8.9HF is specifically formulated to Avoid the Void® while delivering high transfer efficiency with low variability.
This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology.
In addition to outstanding print transfer and response-to-pause, Indium8.9HF Solder Paste also provides a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window.
Indium8.9HF Solder Paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void®. For more information about Indium8.9HF, visit Indium Corporation’s booth #429, email [email protected], or visit indiumstg.wpenginepowered.com/indium8.9series.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
