Indium Corporation將於 9 月 27 日和 28 日在美國伊利諾州 Rosemont 舉辦的SMTA International (SMTAI) 2016上展出其無鹵素Indium8.9HF 免清洗焊膏 。
Indium8.9HF是專為 Avoid the Void® 而配制，同時提供高傳輸效率與低變異性。
此免清洗焊膏因其獨特的氧化阻隔技術，非常適合各種應用，尤其是汽車應用。
除了出色的印刷傳輸和暫停反應之外，Indium8.9HF 錫膏還具備其他多項優點，包括出色的焊針貼合可焊性和填孔性、強大的回流焊能力以及寬廣的製程窗口。
Indium8.9HF Solder Paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void®. For more information about Indium8.9HF, visit Indium Corporation’s booth #429, email [email protected], or visit indiumstg.wpenginepowered.com/indium8.9series.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
