Avoid the Void: Indium Corporation’s Indium8.9HF Solder Paste To Be Featured at SMTAI

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at SMTA International (SMTAI) 2016 on Sept. 27 and 28, in Rosemont, Ill.

Indium8.9HF is specifically formulated to Avoid the Void® while delivering high transfer efficiency with low variability.

This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique oxidation barrier technology.

In addition to outstanding print transfer and response-to-pause, Indium8.9HF Solder Paste also provides a number of other benefits, including excellent pin-in-paste solderability and hole-fill, robust reflow capability, and a wide process window.

Indium8.9HF Solder Paste is part of Indium Corporation’s family of high-performance, lead-free, low-voiding, no-clean solder pastes that help manufacturers to Avoid the Void®. For more information about Indium8.9HF, visit Indium Corporation’s booth #429, email [email protected], or visit www.indium.com/indium8.9series.

インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer To^Another®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。