The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporations Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications. In his presentation, DurafuseTM HTA Drop-in High-Temperature Lead-Free Solution that Outperforms High-Pb Solders in Power Discrete Applications, Dr. Zhang examines a new formulation of Indium Corporations innovative material Durafusea novel design based on a mixed-alloy technologydesigned to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys. This product, Durafuse HT, has shown the feasibility as a drop-in solution to replace high-lead solders for die-attach in power discrete applications by delivering improved performance.
Dr. Zhang is manager of the Alloy Group within Indium Corporations Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed-alloy solder technique that combines the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control a joints morphology, thus improving the reliability. On the basis of this technique, the Durafuse LT, BiAgX, and Durafuse HT solder systems were invented to meet market need. Dr. Zhang has published more than 20 papers and journal articles. He received his Ph.D. in materials science and engineering, as well as a masters degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D, and is a certified SMT Process Engineer.
인디엄 코퍼레이션 소개
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 제품에는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil 이 포함됩니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나Jingya Huang에게 이메일을 보내 주시기 바랍니다. 또한, ‘From One Engineer To Another’(#FOETA)라는 저희 전문가들의 채널을www.linkedin.com/company/indium-corporation/또는@IndiumCorp에서 팔로우하실 수 있습니다.
APEC 소개
응용 전력전자학 컨퍼런스(APEC)는 전력전자 산업의 실용적·응용적 측면에 중점을 둡니다. APEC 프로그램은 모든 종류의 전력전자 장비의 사용, 설계, 제조 및 마케팅에 관한 광범위한 주제를 다룹니다. 수준 높은 전문 교육 세미나, 심사를 거친 논문으로 구성된 알찬 프로그램, 그리고 다양한 전시품으로 가득 찬 전시관이 어우러져 매년 귀중한 교육의 기회를 제공하고 있습니다.
