The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporations Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications. In his presentation, DurafuseTM HTA Drop-in High-Temperature Lead-Free Solution that Outperforms High-Pb Solders in Power Discrete Applications, Dr. Zhang examines a new formulation of Indium Corporations innovative material Durafusea novel design based on a mixed-alloy technologydesigned to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys. This product, Durafuse HT, has shown the feasibility as a drop-in solution to replace high-lead solders for die-attach in power discrete applications by delivering improved performance.
Dr. Zhang is manager of the Alloy Group within Indium Corporations Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed-alloy solder technique that combines the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control a joints morphology, thus improving the reliability. On the basis of this technique, the Durafuse LT, BiAgX, and Durafuse HT solder systems were invented to meet market need. Dr. Zhang has published more than 20 papers and journal articles. He received his Ph.D. in materials science and engineering, as well as a masters degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D, and is a certified SMT Process Engineer.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
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關於 APEC
應用電力電子會議 (APEC) 著重於電力電子業務的實務和應用方面。APEC 課程涵蓋各種電力電子設備的使用、設計、製造和行銷方面的廣泛主題。高品質的專業教育研討會、完整的參考論文，以及人潮洶湧的展覽廳，每年都能提供無價的教育。
