The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporations Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications. In his presentation, DurafuseTM HTA Drop-in High-Temperature Lead-Free Solution that Outperforms High-Pb Solders in Power Discrete Applications, Dr. Zhang examines a new formulation of Indium Corporations innovative material Durafusea novel design based on a mixed-alloy technologydesigned to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys. This product, Durafuse HT, has shown the feasibility as a drop-in solution to replace high-lead solders for die-attach in power discrete applications by delivering improved performance.
Dr. Zhang is manager of the Alloy Group within Indium Corporations Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed-alloy solder technique that combines the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control a joints morphology, thus improving the reliability. On the basis of this technique, the Durafuse LT, BiAgX, and Durafuse HT solder systems were invented to meet market need. Dr. Zhang has published more than 20 papers and journal articles. He received his Ph.D. in materials science and engineering, as well as a masters degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D, and is a certified SMT Process Engineer.
インジウム・コーポレーションについて
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil などがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
APECについて
アプライド・パワー・エレクトロニクス会議（APEC）は、パワーエレクトロニクス事業の実践的・応用的側面に焦点を当てた会議である。APECのプログラムは、あらゆる種類のパワーエレクトロニクス機器の使用、設計、製造、マーケティングに関する幅広いトピックを取り上げています。質の高い専門教育セミナー、充実した論文プログラム、そして充実した展示会場の組み合わせは、毎年一貫して貴重な教育を提供しています。
