The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporations Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-lead solders for die-attachment and clip-bond in power device applications. In his presentation, DurafuseTM HTA Drop-in High-Temperature Lead-Free Solution that Outperforms High-Pb Solders in Power Discrete Applications, Dr. Zhang examines a new formulation of Indium Corporations innovative material Durafusea novel design based on a mixed-alloy technologydesigned to deliver an Sn-rich HTLF paste, presenting the merits of both constituent alloys. This product, Durafuse HT, has shown the feasibility as a drop-in solution to replace high-lead solders for die-attach in power discrete applications by delivering improved performance.
Dr. Zhang is manager of the Alloy Group within Indium Corporations Research & Development Department. His focus is on the development of lead-free solder materials and the associated technologies for high-reliability applications. He and Dr. Ning-Cheng Lee invented the mixed-alloy solder technique that combines the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding interface, and control a joints morphology, thus improving the reliability. On the basis of this technique, the Durafuse LT, BiAgX, and Durafuse HT solder systems were invented to meet market need. Dr. Zhang has published more than 20 papers and journal articles. He received his Ph.D. in materials science and engineering, as well as a masters degree in mechanical engineering from Michigan Technological University. He holds a Lean Six Sigma Green Belt and is a certified IPC specialist for A-600 and IPC-A-610D, and is a certified SMT Process Engineer.
关于铟泰铟泰公司
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
关于亚太经合组织
应用电力电子会议 (APEC) 的重点是电力电子业务的实践和应用方面。APEC 议程涉及各种电力电子设备的使用、设计、制造和营销方面的广泛主题。每年，高质量的专业教育研讨会、完整的参考论文计划和人满为患的展厅都会为与会者提供宝贵的教育机会。
