Indium Corporation will present on preparing graphite sheets to enhance their thermal conductivity during the Electronic Components and Technology Conference (ECTC), to be held virtually from June 1-July 4.
As the power density of microelectronic devices continues to increase, more heat is generated, making effective heat dissipation an important
factor in designing microelectronic devices. As such, an important factor in the performance of electronic assemblies is thermal management via a thermal interface material (TIM). In Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction, Dr. Ning-Cheng Lee, formerly of Indium Corporation, will examine the development of a novel TIM material from graphite that enhances heat conduction vertically.
Dr. Lee was with Indium Corporation from 1986 until his retirement in 2021 as vice president of technology. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for surface-mount technology (SMT) industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT, and is an IEEE fellow. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with Best of Conference awards.
인디엄 코퍼레이션 소개
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재 정제, 제련, 제조 및 공급업체입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, 나노포일 등이 있습니다. 1934년에 설립된 이 회사는 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About the ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
