Indium Corporation will present on preparing graphite sheets to enhance their thermal conductivity during the Electronic Components and Technology Conference (ECTC), to be held virtually from June 1-July 4.
As the power density of microelectronic devices continues to increase, more heat is generated, making effective heat dissipation an important
factor in designing microelectronic devices. As such, an important factor in the performance of electronic assemblies is thermal management via a thermal interface material (TIM). In Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction, Dr. Ning-Cheng Lee, formerly of Indium Corporation, will examine the development of a novel TIM material from graphite that enhances heat conduction vertically.
Dr. Lee was with Indium Corporation from 1986 until his retirement in 2021 as vice president of technology. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for surface-mount technology (SMT) industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT, and is an IEEE fellow. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with Best of Conference awards.
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、钎料、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About the ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
