Indium Corporation will present on preparing graphite sheets to enhance their thermal conductivity during the Electronic Components and Technology Conference (ECTC), to be held virtually from June 1-July 4.
As the power density of microelectronic devices continues to increase, more heat is generated, making effective heat dissipation an important
factor in designing microelectronic devices. As such, an important factor in the performance of electronic assemblies is thermal management via a thermal interface material (TIM). In Methods for Preparing Graphite Sheets with Piercing Treatment to Enhance Vertical Thermal Conduction, Dr. Ning-Cheng Lee, formerly of Indium Corporation, will examine the development of a novel TIM material from graphite that enhances heat conduction vertically.
Dr. Lee was with Indium Corporation from 1986 until his retirement in 2021 as vice president of technology. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for surface-mount technology (SMT) industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT, and is an IEEE fellow. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with Best of Conference awards.
インジウム・コーポレーションについて
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場向けの一流の材料精製、製錬、製造、サプライヤーである。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、ナノフォイルなどがある。1934年に設立され、グローバルな技術サポートと中国、ドイツ、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit www.indium.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.
About the ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
