Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in Melbourne, Fl., USA.
From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Flanagan’s presentation, Understanding Reliability of Low-Temperature Solders and New Developments in Low-Temperature Solder Materials, examines how low-temperature solders are being used to minimize the heat input to a PCBA, reducing high energy costs and the risk for board and component warpage. She’ll discuss the advancements in low-temperature solder technology that enhance solder joint reliability for drop shock environments, including Indium Corporation’s innovative new low-temperature alloy, Durafuse™ LT.
Flanagan is responsible for providing current and prospective customers with guidance and recommendations related to process steps, equipment, techniques, and materials. She also provides technical training to internal staff and external industry partners, and assists with product research and process optimization projects in Indium Corporation’s process development lab. Flanagan has a background in physics and is currently pursuing further education in materials science. She is a Certified SMT Process Engineer and has held previous positions in Quality Engineering. She presents at industry conferences and expos throughout the United States and has authored and contributed to numerous technical papers.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
