Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in Melbourne, Fl., USA.
From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Flanagan’s presentation, Understanding Reliability of Low-Temperature Solders and New Developments in Low-Temperature Solder Materials, examines how low-temperature solders are being used to minimize the heat input to a PCBA, reducing high energy costs and the risk for board and component warpage. She’ll discuss the advancements in low-temperature solder technology that enhance solder joint reliability for drop shock environments, including Indium Corporation’s innovative new low-temperature alloy, Durafuse™ LT.
Flanagan is responsible for providing current and prospective customers with guidance and recommendations related to process steps, equipment, techniques, and materials. She also provides technical training to internal staff and external industry partners, and assists with product research and process optimization projects in Indium Corporation’s process development lab. Flanagan has a background in physics and is currently pursuing further education in materials science. She is a Certified SMT Process Engineer and has held previous positions in Quality Engineering. She presents at industry conferences and expos throughout the United States and has authored and contributed to numerous technical papers.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
