Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in Melbourne, Fl., USA.
From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Flanagan’s presentation, Understanding Reliability of Low-Temperature Solders and New Developments in Low-Temperature Solder Materials, examines how low-temperature solders are being used to minimize the heat input to a PCBA, reducing high energy costs and the risk for board and component warpage. She’ll discuss the advancements in low-temperature solder technology that enhance solder joint reliability for drop shock environments, including Indium Corporation’s innovative new low-temperature alloy, Durafuse™ LT.
Flanagan is responsible for providing current and prospective customers with guidance and recommendations related to process steps, equipment, techniques, and materials. She also provides technical training to internal staff and external industry partners, and assists with product research and process optimization projects in Indium Corporation’s process development lab. Flanagan has a background in physics and is currently pursuing further education in materials science. She is a Certified SMT Process Engineer and has held previous positions in Quality Engineering. She presents at industry conferences and expos throughout the United States and has authored and contributed to numerous technical papers.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
