Indium Corporation expert Kim Flanagan, Technical Support Engineer, will present new developments in low-temperature solder materials at SMTA Space Coast on November 20 in Melbourne, Fl., USA.
From wearable electronics to rework processes, the use of low-temperature solder is expanding in the PCBA industry. Flanagan’s presentation, Understanding Reliability of Low-Temperature Solders and New Developments in Low-Temperature Solder Materials, examines how low-temperature solders are being used to minimize the heat input to a PCBA, reducing high energy costs and the risk for board and component warpage. She’ll discuss the advancements in low-temperature solder technology that enhance solder joint reliability for drop shock environments, including Indium Corporation’s innovative new low-temperature alloy, Durafuse™ LT.
Flanagan is responsible for providing current and prospective customers with guidance and recommendations related to process steps, equipment, techniques, and materials. She also provides technical training to internal staff and external industry partners, and assists with product research and process optimization projects in Indium Corporation’s process development lab. Flanagan has a background in physics and is currently pursuing further education in materials science. She is a Certified SMT Process Engineer and has held previous positions in Quality Engineering. She presents at industry conferences and expos throughout the United States and has authored and contributed to numerous technical papers.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがある。1934年に設立され、グローバルな技術サポートと中国、インド、マレーシア、シンガポール、韓国、英国、米国に工場を持つ。
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
