Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.
SACm™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
The platform consists of Pb-Free solder pastes using Indium Corporation’s patent-pending SACm™ solder paste technology for board-side interconnect, and SACm™ solder balls (spheres) for package-level interconnect.
Indium8.9HF 무할로겐, 무연 솔더 페이스트는 SACm™의 표준 플럭스 차량 중 하나입니다. Indium8.9HF는 고온 및 장시간 리플로우 공정에서 뛰어난 납땜 성능을 제공합니다. 또한 전례 없는 스텐실 인쇄 전사 효율을 제공하여 광범위한 공정에서 작업할 수 있습니다.
Indium Corporation products will be on display at stand 7-430.
For more information about Indium Corporation’s SACm™ solder paste, visit www.indium.com/SACm or email [email protected].
