Indium Corporation will feature SACm™ solder paste at SMT Hybrid Packaging May 6-8 in Nuremberg, Germany.
SACm™ is a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling. SACm™ is doped with manganese and contains less silver than other Pb-free solder pastes. The manganese provides increased strength and the reduced silver content provides a more stable cost structure, especially beneficial for cost-sensitive applications.
The platform consists of Pb-Free solder pastes using Indium Corporation’s patent-pending SACm™ solder paste technology for board-side interconnect, and SACm™ solder balls (spheres) for package-level interconnect.
インジウム8.9HFハロゲンフリー、鉛フリーソルダーペーストは、SACm™の標準フラックスビークルの一つです。Indium8.9HFは、高温・長時間のリフロープロセスにおいて優れたはんだ付け性能を発揮します。また、幅広いプロセスで使用できるよう、これまでにないステンシル印刷の転写効率を提供します。
Indium Corporation products will be on display at stand 7-430.
For more information about Indium Corporation’s SACm™ solder paste, visit www.indium.com/SACm or email [email protected].
