Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif.
NC-26-A is a halogen-free, no-clean flip-chip dipping flux designed to leave a clear, undetectable residue that allows the manufacturer to eliminate the cleaning process.
NC-26-A controls wetting activity to better avoid two main soldering issues that plague manufacturing engineers: solder bridging and cold joints. NC-26-A also retains its bump height after reflow, reduces the UBM/bump crack caused by vibration in the cleaning process, and boasts a higher compatibility with capillary and molded underfills (CUF and MUF).
NC-26-A is designed for flip-chip dipping applications and has tackiness suitable for holding die in mass-reflow assembly processes. For more information on NC-26-A, visit indiumstg.wpenginepowered.com/no-clean-flip-chip-fluxes or visit Indium Corporation at booth 217.
Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
