Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at IMAPS

Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47^th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif.

NC-26-A is a halogen-free, no-clean flip-chip dipping flux designed to leave a clear, undetectable residue that allows the manufacturer to eliminate the cleaning process.

NC-26-A controls wetting activity to better avoid two main soldering issues that plague manufacturing engineers: solder bridging and cold joints. NC-26-A also retains its bump height after reflow, reduces the UBM/bump crack caused by vibration in the cleaning process, and boasts a higher compatibility with capillary and molded underfills (CUF and MUF).

NC-26-A is designed for flip-chip dipping applications and has tackiness suitable for holding die in mass-reflow assembly processes. For more information on NC-26-A, visit indiumstg.wpenginepowered.com/no-clean-flip-chip-fluxes or visit Indium Corporation at booth 217.

Indium Corporation 是全球電子、半導體、太陽能、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil^®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].