Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at IMAPS

Indium Corporation will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47^th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif.

NC-26-A is a halogen-free, no-clean flip-chip dipping flux designed to leave a clear, undetectable residue that allows the manufacturer to eliminate the cleaning process.

NC-26-A controls wetting activity to better avoid two main soldering issues that plague manufacturing engineers: solder bridging and cold joints. NC-26-A also retains its bump height after reflow, reduces the UBM/bump crack caused by vibration in the cleaning process, and boasts a higher compatibility with capillary and molded underfills (CUF and MUF).

NC-26-A is designed for flip-chip dipping applications and has tackiness suitable for holding die in mass-reflow assembly processes. For more information on NC-26-A, visit indiumstg.wpenginepowered.com/no-clean-flip-chip-fluxes or visit Indium Corporation at booth 217.

铟泰公司 面向全球电子、半导体、太阳能、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；^{以及NanoFoil®。}铟泰公司成立于1934年，拥有全球技术支持体系，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。

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