Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.
Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest voids, a reduction in the size of the largest voids, and minimized overall voiding.
Other Indium6.6HF benefits include:
- IEC 61249-2-21 테스트 방법 EN14582에 따른 할로겐 무함유
- Exceptional printing process window:
- High transfer efficiency
- Long stencil life (up to 12 hours)
- Excellent response-to-pause
- Prints consistently at a wide range of speeds
- High tack value (>8 hours) ensures consistent component holding power, allowing high-speed component placement operation
- Cleanable up to at least 72 hours after reflow
For more information about Indium6.6HF, visit: https://www.indium.com/solder-paste-and-powders/water-soluble-products/.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another®(#FOETA), at www.facebook.com/indium or @IndiumCorp.
