Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications.
Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest voids, a reduction in the size of the largest voids, and minimized overall voiding.
Other Indium6.6HF benefits include:
- 無鹵素符合 IEC 61249-2-21 測試方法 EN14582
- Exceptional printing process window:
- High transfer efficiency
- Long stencil life (up to 12 hours)
- Excellent response-to-pause
- Prints consistently at a wide range of speeds
- High tack value (>8 hours) ensures consistent component holding power, allowing high-speed component placement operation
- Cleanable up to at least 72 hours after reflow
For more information about Indium6.6HF, visit: https://www.indium.com/solder-paste-and-powders/water-soluble-products/.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
