Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials.
Nash is responsible for managing new solder paste product development, including strategy guidance and execution, directed to sales to the printed circuit board industry. In addition, he will provide solder paste product support, including leading marketing communications efforts, delivering field sales and technical team training, and interfacing with manufacturing for increased customer support.
Nash has worked for Indium Corporation for more than 10 years and has served in a number of roles, including inside sales, product management, and global technical support. His most recent role was New Product Development Manager for PCBA.
Nash earned his bachelor’s degree from Clarkson University and holds his Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering. He is an SMTA-certified Process Engineer and holds certifications from the IPC for both A-600 and A-610D standards.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
