Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials.
Nash is responsible for managing new solder paste product development, including strategy guidance and execution, directed to sales to the printed circuit board industry. In addition, he will provide solder paste product support, including leading marketing communications efforts, delivering field sales and technical team training, and interfacing with manufacturing for increased customer support.
Nash has worked for Indium Corporation for more than 10 years and has served in a number of roles, including inside sales, product management, and global technical support. His most recent role was New Product Development Manager for PCBA.
Nash earned his bachelor’s degree from Clarkson University and holds his Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering. He is an SMTA-certified Process Engineer and holds certifications from the IPC for both A-600 and A-610D standards.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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