Indium Corporation has named Chris Nash as Product Manager for PCB Assembly Materials.
Nash is responsible for managing new solder paste product development, including strategy guidance and execution, directed to sales to the printed circuit board industry. In addition, he will provide solder paste product support, including leading marketing communications efforts, delivering field sales and technical team training, and interfacing with manufacturing for increased customer support.
Nash has worked for Indium Corporation for more than 10 years and has served in a number of roles, including inside sales, product management, and global technical support. His most recent role was New Product Development Manager for PCBA.
Nash earned his bachelor’s degree from Clarkson University and holds his Six Sigma Green Belt from Dartmouth College’s Thayer School of Engineering. He is an SMTA-certified Process Engineer and holds certifications from the IPC for both A-600 and A-610D standards.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。 产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡等金属及化合物；以及NanoFoil®。铟泰公司成立于1934年，拥有全球技术支持网络，并在中国、马来西亚、新加坡、韩国、英国和美国设有工厂。
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