Indium Corporation’s Eric Bastow, Assistant Technical Manager for the Americas, will present at 2016 Medical Electronics Symposium on Sept. 14-15 in Portland, Ore.
As no-clean soldering processes continue to dominate the electronics manufacturing world, ever-increasing miniaturization is putting pressure on solder paste manufacturers to produce solder pastes that can reliably print through smaller and smaller stencil apertures.
Bastow’s presentation provides an answer to the question: Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue? Bastow uses IPC J-STD-004B SIR (Surface Insulation Resistance) testing to determine if there is a measurable impact on the electrical reliability and, if so, is it substantial enough to be a cause for concern?
Bastow provides technical support for Indium Corporation’s full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets to customers throughout the Americas. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH.
Indium Corporation은 전 세계 전자, 반도체, 박막, 열 관리 및 태양광 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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