Indium Corporation’s Eric Bastow, Assistant Technical Manager for the Americas, will present at 2016 Medical Electronics Symposium on Sept. 14-15 in Portland, Ore.
As no-clean soldering processes continue to dominate the electronics manufacturing world, ever-increasing miniaturization is putting pressure on solder paste manufacturers to produce solder pastes that can reliably print through smaller and smaller stencil apertures.
Bastow’s presentation provides an answer to the question: Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue? Bastow uses IPC J-STD-004B SIR (Surface Insulation Resistance) testing to determine if there is a measurable impact on the electrical reliability and, if so, is it substantial enough to be a cause for concern?
Bastow provides technical support for Indium Corporation’s full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets to customers throughout the Americas. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
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