Indium Corporation’s Eric Bastow, Assistant Technical Manager for the Americas, will present at 2016 Medical Electronics Symposium on Sept. 14-15 in Portland, Ore.
As no-clean soldering processes continue to dominate the electronics manufacturing world, ever-increasing miniaturization is putting pressure on solder paste manufacturers to produce solder pastes that can reliably print through smaller and smaller stencil apertures.
Bastow’s presentation provides an answer to the question: Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue? Bastow uses IPC J-STD-004B SIR (Surface Insulation Resistance) testing to determine if there is a measurable impact on the electrical reliability and, if so, is it substantial enough to be a cause for concern?
Bastow provides technical support for Indium Corporation’s full range of solder products for the electronics assembly, semiconductor packaging, and thermal management markets to customers throughout the Americas. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, Hanover, NH.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理、太陽電池市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
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