Indium Corporation will feature an innovative alloy and solder paste with high-reliability and enhanced-performance capabilities at Productronica, Hall A4, Booth 214, November 12-15, in Munich, Germany.
Indium8.9HF Solder Paste is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.
Indium8.9HF:
- Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- Excellent response-to-pause, even after being left on the stencil for 60 hours
- Enhanced printing and reflow performance after remaining at room temperature for one month
- Consistent printing performance for up to 12 months when refrigerated
- Offers excellent pin-in-paste and through-hole solderability
- 표면이 산화되는 것을 방지하기 위해 조기 플럭스 확산을 방지합니다.
- Performs with both Pb and Pb-free alloys.
Indalloy®292 is an innovative alloy that is engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy provides pinhole elimination, which improves joint appearance. Indalloy®292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.
Indium Corporation은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 이 회사는 중국, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
인듐 코퍼레이션(Indium Corporation)에 대한 자세한 정보는indiumstg.wpenginepowered.com을방문하거나[email protected]으로 이메일을 보내 주시기 바랍니다. 또한www.facebook.com/indium또는@IndiumCorp에서 당사의 전문가 그룹인 From One Engineer ToAnother®(#FOETA)를 팔로우하실 수 있습니다.
