Indium Corporation will feature an innovative alloy and solder paste with high-reliability and enhanced-performance capabilities at Productronica, Hall A4, Booth 214, November 12-15, in Munich, Germany.
Indium8.9HF Solder Paste is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.
Indium8.9HF：
- 透過增強表面絕緣電阻 (SIR)，抑制電流洩漏和樹枝狀生長，提高電氣可靠性
- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- 即使在鋼板上放置 60 小時，仍有極佳的暫停反應
- 在室溫下放置一個月後，印刷和回流焊性能增強
- 冷藏時可保持長達 12 個月的穩定列印效能
- 提供優異的引腳貼合與通孔焊接性
- 防止助焊劑過早擴散，防止表面氧化
- 適用於含 Pb 和不含 Pb 的合金。
Indalloy®292 is an innovative alloy that is engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy provides pinhole elimination, which improves joint appearance. Indalloy®292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。公司成立於 1934 年，擁有全球性的技術支援，工廠位於中國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需進一步了解 Indium Corporation，請造訪indiumstg.wpenginepowered.com或發送電子郵件至 [email protected]。您也可以在www.facebook.com/indium或@IndiumCorp 追蹤我們的專家團隊「From One Engineer ToAnother®」（#FOETA）。
