Indium Corporation will feature an innovative alloy and solder paste with high-reliability and enhanced-performance capabilities at Productronica, Hall A4, Booth 214, November 12-15, in Munich, Germany.
Indium8.9HF Solder Paste is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance electrical reliability, and improve stability during the printing process.
铟8.9HF：
- Increases electrical reliability via enhanced surface insulation resistance (SIR) that inhibits current leakage and dendritic growth
- Ensures low-voiding on bottom termination components (ex. QFN, DPAK, LGA)
- Delivers supreme product stability with:
- Excellent response-to-pause, even after being left on the stencil for 60 hours
- 在室温下放置一个月后，印刷和回流焊性能得到增强
- Consistent printing performance for up to 12 months when refrigerated
- Offers excellent pin-in-paste and through-hole solderability
- 防止助焊剂过早扩散，防止表面氧化
- Performs with both Pb and Pb-free alloys.
Indalloy®292 is an innovative alloy that is engineered to provide advanced reliability for high-performance applications, offering excellent thermal cycling performance at -40/150°C conditions, high shear strength, and low solder joint cracking. Additionally, the alloy provides pinhole elimination, which improves joint appearance. Indalloy®292 offers outstanding printability, stability, and enhanced SIR performance when paired with Indium8.9HF Solder Paste.
铟泰公司 面向全球电子、半导体、薄膜及热管理 顶级材料制造商和供应商。产品包括焊料和助焊剂；硬钎焊；热界面材料；溅射靶材；铟、镓（Ga）、锗和锡的金属及化合物；以及NanoFoil®。公司成立于1934年，拥有全球技术支持网络，并在中国、印度、马来西亚、新加坡、韩国、英国和美国设有工厂。
如需了解铟泰公司更多信息，请访问indiumstg.wpenginepowered.com或发送电子邮件至 [email protected]。您还可以通过www.facebook.com/indium或@IndiumCorp 关注我们的专家团队“From One Engineer ToAnother®”（#FOETA）。
