Indium Corporation's Dr. Ron Lasky, Senior Technologist, will share his expertise at the Dallas SMTA Technical Presentation and Luncheon, Sept. 18 in Carrollton, Texas.
Dr. Lasky’s presentation, Minimizing SMT Assembly Defects: Graping, Head-in-Pillow, and Voiding, details the challenges that result from the drive toward smaller electronic devices, which require smaller solder joints. Dr. Lasky will also review how to minimize graping, head-in-pillow and voiding defects with materials and process modifications.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned SMT process expert. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion.
Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of SMTA engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
Indium Corporation은 전 세계 전자, 반도체, 박막, 열 관리 및 태양광 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.
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