Indium Corporation's Dr. Ron Lasky, Senior Technologist, will share his expertise at the Dallas SMTA Technical Presentation and Luncheon, Sept. 18 in Carrollton, Texas.
Dr. Lasky’s presentation, Minimizing SMT Assembly Defects: Graping, Head-in-Pillow, and Voiding, details the challenges that result from the drive toward smaller electronic devices, which require smaller solder joints. Dr. Lasky will also review how to minimize graping, head-in-pillow and voiding defects with materials and process modifications.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned SMT process expert. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion.
Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of SMTA engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
インジウム・コーポレーションは、世界のエレクトロニクス、半導体、薄膜、熱管理、太陽電池市場に材料を供給する一流メーカーです。製品には、はんだおよびフラックス、ろう材、熱界面材料、スパッタリングターゲット、インジウム、ガリウム、ゲルマニウム、スズの金属および無機化合物、NanoFoil®などがあります。1934年に設立されたインジウムは、グローバルな技術サポートと中国、マレーシア、シンガポール、韓国、英国、米国に工場を有しています。
インジウム・コーポレーションについての詳細は、www.indium.comをご覧いただくか、[email protected] まで電子メールでお問い合わせください。また、当社の専門家であるFrom One Engineer ToAnother®(#FOETA)を、www.facebook.com/indiumまたは@IndiumCorp でフォローすることもできます。
