Indium Corporation's Dr. Ron Lasky, Senior Technologist, will share his expertise at the Dallas SMTA Technical Presentation and Luncheon, Sept. 18 in Carrollton, Texas.
Dr. Lasky’s presentation, Minimizing SMT Assembly Defects: Graping, Head-in-Pillow, and Voiding, details the challenges that result from the drive toward smaller electronic devices, which require smaller solder joints. Dr. Lasky will also review how to minimize graping, head-in-pillow and voiding defects with materials and process modifications.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned SMT process expert. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion.
Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of SMTA engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
Indium Corporation 是全球电子、半导体、薄膜、热管理和太阳能市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。Indium 公司成立于 1934 年，在中国、马来西亚、新加坡、韩国、英国和美国拥有全球性的技术支持和工厂。
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