Indium Corporation's Dr. Ron Lasky, Senior Technologist, will share his expertise at the Dallas SMTA Technical Presentation and Luncheon, Sept. 18 in Carrollton, Texas.
Dr. Lasky’s presentation, Minimizing SMT Assembly Defects: Graping, Head-in-Pillow, and Voiding, details the challenges that result from the drive toward smaller electronic devices, which require smaller solder joints. Dr. Lasky will also review how to minimize graping, head-in-pillow and voiding defects with materials and process modifications.
Dr. Lasky, holder of the prestigious SMTA Founder’s Award, is a world-renowned SMT process expert. He is also a Professor of Engineering and the Director of the Cook Engineering Design Center at Dartmouth College. He has more than 30 years of experience in electronics and optoelectronic packaging and assembly. Dr. Lasky has authored six books, and contributed to nine more on science, electronics, and optoelectronics. Additionally, he has served as an adjunct professor at several colleges, teaching more than 20 different courses on topics ranging from electronics packaging, materials science, physics, mechanical engineering and science, and religion.
Dr. Lasky holds numerous patent disclosures and is the developer of several SMT processing software products relating to cost estimating, line balancing, and process optimization. He is the co-creator of SMTA engineering certification exams that set standards in the electronics assembly industry, worldwide. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
