Related Gold Preforms Blog Articles
Cardiac pacemakers generally use 99.99% Au preforms as the solder material in the assembly. Pure gold is highly pure, inert, biocompatible, has a high resistance to corrosion, and works excellently to provide a hermetic seal in the device. All of these properties provide the perfect solder material required for the high quality and performance needed for implantable medical devices.Read More
When looking at the reliability of AuSn solder paste, you need to take a couple of things into consideration, the post reflow alloy composition (off-eutectic) and the correct flux for the application are two of these.Read More
Today's electronics continue to get smaller and smaller, so the traditional type 3 (-200/+325) mesh size might be too large for new scale-ups. This blog post reviews Indium Corporation's capabilities for making smaller AuSn particle sizes.Read More
We’re featuring our Au solder product line and braze materials at the High-Temperature Electronics Network (HiTEN 2019) at St. Anne’s College in Oxford, UK.Read More
Why is Indium Corporation excited to be exhibiting at the International Microwave Symposium in Boston, MA?Read More
Features & Benefits
- Provide Pure Au, AuSn, AuGe, AuSi
- Broad range of geometric capabilities
- Custom designs
- State-of-the-art stamping technology
- Precision-made, high-quality parts
- World-class in-house tooling expertise
- Industry-leading quality inspection and measurement techniques
- Engineering support from design to production
- Standard packaging options include bulk, layer, waffle, and tape & reel
- Custom packaging available
- Thickness from 0.0127mm (0.0005”) and greater
- Tight dimensional tolerances ensure repeatable solder volume
- Flatness measurement capabilities to 0.00254mm (0.0001”)
- Large die library with in-house tooling capabilities
- Tiny solid shapes from 0.152mm (0.006”)
- High aspect ratio and complex special shapes
Indium Corporation’s AuLTRA® ThInFORMS™ are an excellent choice for die-attach applications. By using a preform with a thickness of 0.00035", the BLT is reduced and thermal transfer from the die to the substrate is improved, increasing the operational performance and efficiency of high-output lasers. Packaging designed for automated assembly of these preforms ensures repeatable success in a production process.
Indium Corporation developed our AuLTRA®-Fine Ribbon, Indalloy®182 fine-grade precision ribbon, for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and quality of the ribbon and spooling is of the utmost importance along with long, continuous lengths. These features help minimize production down-time and facilitate an efficient, high-throughput process resulting in a high quality end product and low cost of ownership.
Off-eutectic Gold Preforms
Off-eutectic alloys’ solidus (not melted) and liquidus (completely melted) temperatures are different. The difference creates a molten range where the mixture looks plastic or pasty. With Gallium Nitride (GaN) dies becoming popular in high frequency, high power, and high reliability RF power amplifier devices for 5G and other critical military and aerospace wireless communications, soldering for these popular dies can be very challenging. GaN dies have a thick gold plating to prevent oxidation, about ten times thicker than usual. This gold plating can skew the final joint composition, post reflow, away from a final joint composition of 80Au20Sn. It’s extremely crucial that the solder joint maintain the eutectic composition of 80Au20Sn to benefit from all the unique properties of the alloy, mainly the high joint strength.
Off-eutectic product development becomes a solution to the soldering of the gold-rich die. By lowering the gold content of the alloy, there is room for the solder to absorb some of the gold from the plating and end up with a final strong joint comprised of the eutectic 80Au20Sn.
Off-eutectic alloys from Indium Corporation
|Alloy||Temperature (solidus)||Temperature (liquidus)|
|Au75Sn25 – Indalloy®270||278||332|
|Au78Sn22 – Indalloy®269||278||301|
|Au79Sn21 - Indalloy®271||278||289|
Indium Corporation’s packaging protects your solder preforms during shipping and handling, and is designed for ease of introduction into the manufacturing process.
- Jar or bulk pack
- Array tray pack
- Waffle pack
- Bulk tray pack
- Tape & reel
Gold Preform Quick Turn Program
Need a gold preform right away? Contact us for our Quick Turn Program:
- Designed to deliver parts quickly and affordably
- New design, new tool, prototype quantities in 1-2 WEEKS
- Engineering support from design to production
- Gold and Gold-Based Solders in a Variety of Forms
Need a gold preform right away? Contact us for help choosing the right materials for your brazing and soldering applications.