在测试焊料润湿性能时，我最常使用的是球形铟，因为它们有精确的体积。(与喷丸不同，喷丸没有严格的尺寸控制或球形度限制）。球形通常用作倒装芯片连接和 BGA 器件的互连。我们还提供与其他元素（如银）合金化的球体。合金化铟通常会使材料变硬，降低其冷焊能力。
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