塞思-霍默混合动力汽车、绿色能源和电源管理只是利用绝缘栅双极晶体管技术（IGBT）的几个行业。但是，如果考虑到对更高功率密度的不懈追求，以及更高的功率循环，就会对这项技术提出更高的要求。对 IGBT 需求的增长一直延伸到器件的互连层。传统上，我们依靠正确制造和应用焊接材料的物理属性来实现一致性。然而，对可靠性和性能的要求正在挑战这些传统。实现卓越性能和可靠性的唯一合理途径就是重新定义焊料在这一过程中的作用。
In this series, I will explore considerations for redefining solder at three attach levels of peak concern in the IGBT stackup: the die level, the substrate level and the baseplate level. At the die-attach level our goal is to achieve low-voiding and improved wetting. For DBC substrate to baseplate, it is critical to achieve consistent bondline thickness or co-planarity. And when it comes to baseplate to heat-sink level we must ensure that the thermal transfer capabilities are resistant to degradation. This video is one of a four video series in which I will share with you detailed considerations and unique solutions developed by Indium Corporation to address the challenges at each level.
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