Indium Corporation has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen with 01005 and 008004 components.
SiPaste C201HF combines superior, industry-leading non-wet open (NWO) performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. It leaves behind a cleanable residue, able to be removed with a commercially available semi-aqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not applicable.
SiPaste C201HF features excellent transfer efficiency on fine feature apertures, with consistent process yields below 80m.
SiPaste C201HF delivers:
- 多次印刷时焊料沉积均匀一致；卓越的暂停响应性能
- 在间距较小的组件上尽量减少空隙，确保小型组件的连接强度
- 对翘曲较大的元件具有出色的回流焊性能
- 增强了坍落度性能，装配过程中的桥接最小，提高了紧凑间距组件的产量
- 清洗灵活；可用于需要用皂化剂清洗或不需要清洗的工艺中
For more information about Indium Corporation’s pastes for fine feature printing, contact Evan Griffith, Product Specialist – Semiconductor and Advanced Assembly Materials.
关于铟泰公司
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料提炼商、冶炼商、制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil 。公司成立于 1934 年，在中国、德国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂，并提供全球技术支持。
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