One of the most highly demanded applications for 80Au/20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at the International Microwave Symposium, Denver, Colo., June 1924.
One method for facilitating thermal transfer from the die to the substrate is to reduce the bondline thickness through the use of thinner 80Au/20Sn preforms. By using a thinner preform in the bondline, the heat is transferred away from the die more quickly, increasing the longevity and potential of the die. In The Effect of Semiconductor Laser Thermal Transfer in Relation to AuSn Preform Thickness, Gallery will examine the impact of AuSn preform thickness on thermal transfer by examining voiding percentages on several 80Au/20Sn preforms ranging from 0.002 to 0.00035 thick.
Gallery is a product specialist for the high-temperature business (gold and braze products) at Indium Corporation. She is responsible for researching and analyzing customer and market data, and she serves as a resource to the companys current and prospective customers, field sales, and internal departments. She provides product and process support for solder preforms, wire, ribbon, and paste, and she helps to facilitate relationships and new business development. Gallery earned her bachelors degree in chemistry at the University of Albany, N.Y., U.S.
关于铟泰铟泰公司
铟泰公司是全球电子、半导体、薄膜和热管理市场首屈一指的材料精炼商、冶炼商、制造商和供应商。 产品涵盖焊料与助焊剂、硬焊料、热界面材料、溅射靶材、铟、镓、锗、锡等金属及无机化合物,以及NanoFoil™( )。公司创立于1934年,拥有全球技术支持体系,工厂遍布中国、德国、印度、马来西亚、新加坡、韩国、英国及美国。
如需了解更多铟泰公司信息,请访问www.indium.com或发送邮件至黄静雅。您还可关注我们的专家团队"工程师同行"(,#FOETA)的推特账号www.linkedin.com/company/indium-corporation/或@IndiumCorp。
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