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Indium Corporation Features Heat-Spring for LED Manufacturing at Strategies in Light

Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at Strategies in Light, Feb. 24-26 in Las Vegas, Nev.

The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.

Indium Corporation’s Heat-Spring is a compressible interface material that provides 86W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring offers superior conductivity and ease of use as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process.

Heat-Spring is reclaimable and recyclable, and is packaged in custom trays or tape & reel.

Heat-Spring is just one of a wide range of Indium Corporation materials for the LED assembly industry, from PCB assembly to die-attach to technology-enabling TIM, that combines superior performance with ease of placement. This reduces cost, increases first-pass yield, reduces field failures, and contributes to the optimization of profit.

For more information on Heat-Spring, visit indiumstg.wpenginepowered.com/thermal-interface-materials/heat-spring or visit Indium Corporation at booth 623.

Indium Corporation은 전 세계 전자, 반도체, 태양광, 박막 및 열 관리 시장에 최고의 소재를 제조 및 공급하는 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열 인터페이스 재료, 스퍼터링 타겟, 인듐, 갈륨, 게르마늄, 주석 금속 및 무기 화합물, NanoFoil® 등이 있습니다. 1934년에 설립된 Indium은 중국, 말레이시아, 싱가포르, 한국, 영국, 미국에 글로벌 기술 지원 및 공장을 보유하고 있습니다.

For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].