Indium Corporations Leo Hu, senior area technical manager – East China, will present on fine feature solder paste printing for SiP at SiP Conference China, May 21, Shanghai, China.
The industry has seen a surge in demand for system-in-package (SiP) devices, which are capable of increased functionality and higher performance, as well as other benefits, in a smaller package design. These advantagescombined with heterogeneous integrationcontinue to push miniaturization forward in the quest to create smaller stencil apertures
(such as below 90m) and tighter gap between pads (such as below 50m). At the same time, these advancements have necessitated more critical solder paste printing requirements. In Fine Feature Solder Printing for SiP, Hu will examine Type 6 and Type 7 ultrafine pitch solder paste printing, commonly used for these applications due to the smaller aperture designs. He will also share data that explains the influence of powder size vs. area ratio, how powder size affects printing performance, application notes, and a related case study.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has nearly 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a masters degree in IC engineering from the Chinese Academy of Science and a bachelors degree in electronic information science and technology from Nankai University, Tianjin, China.
For more information on Indium Corporations ultra-low residue fluxes, visit indiumstg.wpenginepowered.com/fluxes or visit Indium Corporations booth.
인디엄 코퍼레이션 소개
인듐 코퍼레이션(Indium Corporation)은 전 세계 전자, 반도체, 박막 및 열 관리 시장에 소재 정제, 제련, 제조 및 공급 서비스를 제공하는 선도적인 기업입니다. 주요 제품으로는 솔더 및 플럭스, 브레이즈, 열전도성 인터페이스 재료, 스퍼터링 타겟, 인듐·갈륨·게르마늄·주석 금속 및 무기 화합물, 그리고 NanoFoil 등이 있습니다. 1934년에 설립된 이 회사는 전 세계적인 기술 지원 체계를 갖추고 있으며, 중국, 독일, 인도, 말레이시아, 싱가포르, 한국, 영국, 미국에 공장을 운영하고 있습니다.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/or @IndiumCorp.
SiP Conference China
SiP Conference China is widely regarded as the most prominent SiP Conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise, and all aspects of the SiP design chain, including assembly and test from OSAT, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries, as well as material and equipment suppliers.
