Indium Corporations Leo Hu, senior area technical manager – East China, will present on fine feature solder paste printing for SiP at SiP Conference China, May 21, Shanghai, China.
The industry has seen a surge in demand for system-in-package (SiP) devices, which are capable of increased functionality and higher performance, as well as other benefits, in a smaller package design. These advantagescombined with heterogeneous integrationcontinue to push miniaturization forward in the quest to create smaller stencil apertures
(such as below 90m) and tighter gap between pads (such as below 50m). At the same time, these advancements have necessitated more critical solder paste printing requirements. In Fine Feature Solder Printing for SiP, Hu will examine Type 6 and Type 7 ultrafine pitch solder paste printing, commonly used for these applications due to the smaller aperture designs. He will also share data that explains the influence of powder size vs. area ratio, how powder size affects printing performance, application notes, and a related case study.
胡先生於 2016 年加入 Indium Corporation，現駐中國蘇州。他在半導體封裝領域擁有近 15 年的經驗，是先進組裝技術開發、製程改善及組裝材料應用方面的資深專家。 胡先生曾於多家業界領先的外包組裝與測試（OSAT）公司擔任多項職務，包括製程工程師、專案工程師、資深研發工程師及首席工程師。他擁有中國科學院的積體電路工程碩士學位，以及中國天津南開大學的電子資訊科學與技術學士學位。
For more information on Indium Corporations ultra-low residue fluxes, visit indiumstg.wpenginepowered.com/fluxes or visit Indium Corporations booth.
關於 Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email Jingya Huang. You can also follow our experts, From One Engineer To Another (#FOETA), at www.linkedin.com/company/indium-corporation/or @IndiumCorp.
SiP Conference China
SiP Conference China is widely regarded as the most prominent SiP Conference in China. The highly informative annual gathering offers the best in electronic system design and SiP packaging expertise, and all aspects of the SiP design chain, including assembly and test from OSAT, EMS, OEMs, IDM, fabless semiconductor companies and silicon foundries, as well as material and equipment suppliers.
